
◆ Micro-materials fracture problem
Microdevices such as LSI and MEMS/NEMS are complex structures containing
numerous numbers of micro-scale components. The structural integrity of
the microdevices, just like an engine or a gear box, depends on the reliability
of each minute component. It is therefore critically important to know
the mechanical properties of micro-materials under various physical and/or
chemical conditions.
We developed a special experimental technique to approach this issue.
Micro-specimens were fabricated with an ion-beam processing method, and
they were subjected to in situ deformation/fracture tests under electron
microscopy. The example shown here (i.e. fracture nucleation from an interface
edge) reveals that the scatter of strength value is significantly influenced
by the wedge shape. This may be attributable to the effect of granular
structure of Cu film.
For more detail, see:
Y. Takahashi, K. Aihara, I. Ashida, K. Higuchi, Y. Yamamoto, S. Arai, S.
Muto, N. Tanaka, Evaluation of interfacial fracture strength in micro-components
with different free-edge shape, Mechanical Engineering Journal, Vol. 3,
No. 6, 2016, ID: 16-00108
(https://doi.org/10.1299/mej.16-00108)
Related studies:
Y. Takahashi, I. Ashida, S. Arai, K. Higuchi, Y. Yamamoto, S. Muto, Interfacial
fracture strength evaluation of Cu/SiN micro-components: applicability
of the linear fracture mechanics criterion under a hydrogen environment,
International Journal of Fracture, Vol. 210, 2018, pp. 223–231 (https://doi.org/10.1007/s10704-018-0269-8)
Y. Takahashi, S. Arai, Y. Yamamoto, K. Higuchi, H. Kondo, Y. Kitagawa,
S. Muto, N. Tanaka, Evaluation of interfacial fracture strength in micro-scale
components combined with high-voltage environmental electron microscopy,
Experimental Mechanics, Vol. 55, 2015, pp. 1047-1056 (https://doi.org/10.1007/s11340-015-0008-2)
Y. Takahashi, H. Kondo, H. Niimi, T. Nokuo, T. Suzuki, Fracture strength
analysis of single-crystalline silicon cantilevers processed by focused
ion beam, Sensors & Actuators: A. Physical, Vol. 206, 2014, pp. 81–87
(https://doi.org/10.1016/j.sna.2013.11.037)